Black Pepper Technologies-Spicing up Innovations through Best in Class SOC Design Services
The semiconductor industry has been ruled by a simple creed: smaller, faster and cheaper. The advantage of being tiny is pretty simple: finer lines mean more transistors can be packed onto the same chip. And consequently the more transistors on a chip, the faster it can do its task. Credits to the tight competition and to new technologies that lower the cost of production per chip, within a matter of months, causing the price of a new chip to fall by 50 percent. As a result, there is constant pressure on chip makers to come up with something better and even cheaper than what redefined state-of-the-art only a few months before. 
The future Key competencies that go under Physical Design Implementation capability are Hierarchical Full Chip SOC that facilitates Ultra Large Designs and die sized budgeting & die sized optimization.
Headquartered in Bangalore, Karnataka, Black Pepper Technologies, with Hari Krishnan Puravankar as the CEO, is leaving no stone unturned to keep up with the dynamic technological upgrades in semiconductors and deliver the best chip design services for the current requirements. Black Pepper Technologies is a new generation, Silicon to System Design Service
Company that is committed in providing differentiating design service capability from Tier-one to Tier- three semiconductor companies across the world. Black pepper started its business operation in Q4 of 2010, to deliver comprehensive design services for nanometer SoC, SiP & allied areas of semiconductors. Black Pepper has design service offerings namely- Synthesis, STA, Physical design, -, DFT, Package design, Post Silicon Validation, and Supply Chain Management.
The future Key competencies that go under Physical Design Implementation capability are Hierarchical Full Chip SOC that facilitates Ultra Large Designs (Fully abutted to partially abutted implementation) and die sized budgeting & die sized optimization. Apart from that some of the promising future offerings of Black Pepper include Analog Mixed Signal design, specialized verification, IP vendoring, Embedded S/W design and FPGA/Board Design.
The company ensures complete flexibility to the customers to choose engagement models by letting them choose design service engagements only for a specific individual engineering offering (E.g. :- Physical Design alone) or end-to-end offering (E.g. :- Concept to Silicon, ) for the project. Black Pepper can operate as a standalone turnkey service provider or or catering critical high end consultancy under each engineering offering.
BlackPepper is on its way to be in SME IPO listing sooner than later, which will be followed by full IPO listing. Black Pepper claims to be ahead in the competition to address the emerging IOT market space because of the significant values it brings to the customers with their 3DValues™ system. With their three important differentiating values ( LTE ™, DEOD ™, SSCS ™) delivered under 3DValues, Black Pepper is positioned to offer the customers distinctive advantage in Cost, Reliability, TAT, Technology axis. With world class engineering practices, premium technology knowhow and ‘the service technology platform-EYWA’ BalckPepper is well positioned to deliver end-to-end concept to product design services it customers Tier1 through Tier3 making them a “single stop shop” for design solutions
The team is determined to make BlackPepper India’s first billion dollar hardware company by 2020.
The future Key competencies that go under Physical Design Implementation capability are Hierarchical Full Chip SOC that facilitates Ultra Large Designs (Fully abutted to partially abutted implementation) and die sized budgeting & die sized optimization. Apart from that some of the promising future offerings of Black Pepper include Analog Mixed Signal design, specialized verification, IP vendoring, Embedded S/W design and FPGA/Board Design.
The company ensures complete flexibility to the customers to choose engagement models by letting them choose design service engagements only for a specific individual engineering offering (E.g. :- Physical Design alone) or end-to-end offering (E.g. :- Concept to Silicon, ) for the project. Black Pepper can operate as a standalone turnkey service provider or or catering critical high end consultancy under each engineering offering.
BlackPepper is on its way to be in SME IPO listing sooner than later, which will be followed by full IPO listing. Black Pepper claims to be ahead in the competition to address the emerging IOT market space because of the significant values it brings to the customers with their 3DValues™ system. With their three important differentiating values ( LTE ™, DEOD ™, SSCS ™) delivered under 3DValues, Black Pepper is positioned to offer the customers distinctive advantage in Cost, Reliability, TAT, Technology axis. With world class engineering practices, premium technology knowhow and ‘the service technology platform-EYWA’ BalckPepper is well positioned to deliver end-to-end concept to product design services it customers Tier1 through Tier3 making them a “single stop shop” for design solutions
The team is determined to make BlackPepper India’s first billion dollar hardware company by 2020.
